| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cleaning method which prevents pattern collapse of a wafer having a concave-convex pattern formed on the surface. <P>SOLUTION: A concave-convex pattern consisting of protrusions 3 and recesses 4 is formed on the surface of a wafer 1, and in a state where liquid 9 is held at least in the recesses 4 of the concave-convex pattern, a water repellency protection film 10 is formed by holding a chemical for forming a water repellency protection film not containing acid and base but containing dialkyl silyl compound on the surface. In a state where the water repellency protection film 10 is held on the surface of the wafer 1, the liquid 9 is removed from the recesses 4. <P>COPYRIGHT: (C)2012,JPO&INPIT |
