发明名称 CHUCK TABLE
摘要 <P>PROBLEM TO BE SOLVED: To provide a chuck table capable of reliably suction-holding a wafer in a suction region even if the wafer has a several millimeter error in its diameter. <P>SOLUTION: A chuck table for holding a wafer comprises: a suction chuck composed of a main suction-holding member made of a porous member formed into a disk shape, and an annular auxiliary suction-holding member which is arranged on a circumference of the main suction-holding member with a barrier rib interposed therebetween so as to adjust the size error of the wafer; and a frame body having on its top face a circular recess in which the suction chuck is fitted. On a bottom wall of the frame body, a main suction passage is provided at a position corresponding to the main suction-holding member, and an auxiliary suction passage is provided at a position corresponding to the annular auxiliary suction-holding member. A blind plug can be detachably attached to the auxiliary suction passage. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012033640(A) 申请公布日期 2012.02.16
申请号 JP20100170972 申请日期 2010.07.29
申请人 DISCO ABRASIVE SYST LTD 发明人 YAMANAKA SATOSHI
分类号 H01L21/304;B23Q3/08;B24B41/06;H01L21/683 主分类号 H01L21/304
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