| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition which is excellent toughness in a high temperature without lowering excellent heat resistance or formability in a thermosetting resin, especially in an epoxy resin. <P>SOLUTION: A thermosetting resin composition comprises (a) an epoxy resin, (b) a curing agent, and (c) a silicone polymer containing bifunctional siloxane units represented by formula R<SB POS="POST">2</SB>SiO<SB POS="POST">2/2</SB>in the molecule (wherein, R is equal or different organic group) as essential components. <P>COPYRIGHT: (C)2012,JPO&INPIT |
