METHOD AND APPARATUS FOR ONE-SIDE CHEMICAL MECHANICAL POLISHING SILICON WAFERS

摘要

Disclosed is a method for one-side chemical mechanical polishing silicon wafers. A rinsing polishing stage is operated after a primary polishing stage and/or a finishing polishing stage. An apparatus for one-side chemical mechanical polishing silicon wafers includes a primary polishing table (17) and/or a finishing polishing table (10) and a cleaning table (8). The method and apparatus of the present invention can effectively reduce or eliminate residual of polishing liquid on surface of silicon wafers, thus greatly improving the one-side polishing quality of silicon wafers, and can satisfy the flatness and microscopic roughness for silicon wafers having a big diameter of no less than 300 mm.