Disclosed is a curable composition which has low viscosity and thus exhibits good workability. The curable composition provides a cured product that has excellent mechanical strength. Specifically disclosed is a curable composition which contains: a curable resin component that contains a polymer (A) which has a polyoxyalkylene chain, a reactive silicon group, and a urethane bond in each molecule; and at least one silicate mineral (X) which is selected from the group consisting of silicate minerals (B) represented by AlO·2SiO·nHO (wherein n is a number of 0-4) and fired silicate minerals (C) which are obtained by firing the silicate minerals (B) at 350-1,200˚C.
