| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device provided with a semiconductor package formed by encapsulating by a mold resin a semiconductor element with a heat radiation metal body connected, and cooling means for flowing coolant, which cools a heat radiation surface of the metal body by the coolant and definitely makes a conductor layer forming the heat radiation surface of the metal body and the cooling means to be equipotential. <P>SOLUTION: The semiconductor device comprises a terminal member 90 with one end being electrically connected with conductor layers 23 and 33 in a mold resin 60 and another end extruding from the mold resin 60 and being electrically connected with cooling means 200. The conductor layers 23 and 33 and the cooling means 200 are electrically connected via the terminal member 90. <P>COPYRIGHT: (C)2012,JPO&INPIT |
