发明名称 LAMINATED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a laminated substrate in which position deviation of alignment marks of respective film substrates is suppressed and the respective film substrates are accurately laminated, and a method of manufacturing the laminated substrate. <P>SOLUTION: After forming a photoresist layer by applying photoresist to the film substrate 51 and baking it, the alignment marks 501 are formed to complete a wiring power supply layer 50. After forming a photoresist layer on the film substrate 41, the alignment marks 501 are transcribed to form the alignment marks 401. A signal processing layer 40 is completed and bonded with the wiring power supply layer 50 with the alignment marks 401 and 501 as references. Similarly, the alignment marks are formed successively from a lower layer, and the respective layers are bonded to complete a scanner 1. By heating of baking for forming the photoresist layers, the film substrates are contracted. Thereafter, the alignment marks 101, 201, 301, 401 and 501 are formed. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012033776(A) 申请公布日期 2012.02.16
申请号 JP20100172990 申请日期 2010.07.30
申请人 BROTHER IND LTD 发明人 MIYABAYASHI TAKESHI;INOUE TOYOKAZU
分类号 H05K3/00;G03F9/00;H01L23/12 主分类号 H05K3/00
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