| 摘要 |
Provided is a device mounting structure that includes: a interposer substrate including a substrate and a plurality of through-hole interconnection; a first device including a plurality of electrodes arranged so as to face the first principal surface of the substrate; and a second device including a plurality of electrodes whose arrangement is different from that of the first device, with the electrodes arranged so as to face the second principal surface of the substrate. Each through-hole interconnection includes a first conductive portion provided at a position on the first principal surface corresponding to the electrode of the first device, and a second conductive portion provided at a position on the second principal surface corresponding to the electrode of the second device. Each electrode of the first device is electrically connected with the first conductive portion. Each electrode of the second device is electrically connected with the second conductive portion.
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