发明名称 HANDLER BLADE FOR TRANSFERRING WAFER
摘要 PURPOSE: A handler blade for transferring a wafer is provided to prevent pieces of the wafer generated when the wafer is damaged from being left on the blade by minimizing the settlement area of the blade in which the wafer is settled. CONSTITUTION: A coupling part(210) is coupled to a side of a robot arm. The first and second settlement wings(230,240) extend in parallel to a side of the coupling part, separated from each other. A stepped part is formed in an interface between the coupling part and the settlement wings, downwardly stepped toward the settlement wings. A settlement projection(260) is positioned in the same line as the settlement surface of the settlement wings in the stepped part so that the edge of the wafer is settled as a string type in the settlement projection.
申请公布号 KR20030036952(A) 申请公布日期 2003.05.12
申请号 KR20010067902 申请日期 2001.11.01
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHO, SEUNG RAE;CHOI, JONG TAEK;KANG, GYEONG HO;YOON, YONG JO
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
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