| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve a temperature reduction effect of a semiconductor element in a stacked-type semiconductor device. <P>SOLUTION: A stacked-type semiconductor device 50 is configured by stacking a semiconductor 5 on a semiconductor package 1 via a connection terminal 8, and is three-dimensionally mounted on a mother board 51. The stacked-type semiconductor device 50 includes a heat dissipation member 10 disposed between the semiconductor packages 1 and 5. The heat dissipation member 10 has a contact portion 10a thermally contacting both the semiconductor packages 1 and 5 and an overhanging portion 10b overhanging more to the outside than the outer peripheral edges of the semiconductor packages 1 and 5. In the contact portion 10a of the heat dissipation member 10, an opening portion 11 through which a plurality of connection terminals 8 are penetrated is formed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
