| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a selection support apparatus or the like for solder joint underfill materials realizing an electronic package with high efficiency and reliability, with no need of labor such as an experiment. <P>SOLUTION: The selection support apparatus creates a finite element model based on each size of respective components other than underfill materials included in an electronic package; and determines two or more solder balls out of a plurality of solder balls included in the electronic package as marking solder balls having maximum displacement, maximum stress, or maximum strain. The selection support apparatus also sets a part of the marking solder balls as nodes; calculates the nodes' deformation based on temperature environment information of the electronic package and materials properties of each member; calculates a value of a target function F(X) based on calculated difference of deformation between two nodes (ND<SB POS="POST">i</SB>(x,y,z)-ND<SB POS="POST">j</SB>(x,y,z)) defining the materials properties of underfill member as a variable X for optimization; and presents a variable X with which the target function F(X) converges at a minimum value as an optimum materials properties of the underfill material. <P>COPYRIGHT: (C)2012,JPO&INPIT |
