发明名称 FILLING SMALL DIMENSION VIAS USING SUPERCRITICAL CARBON DIOXIDE
摘要 Suitable particles may be deposited within an extremely small high-aspect ratio via by flowing the particles in a suspension using supercritical carbon dioxide. The particles may be made up of diblock copolymers or silesquioxane-based materials or oligomers of phobic homopolymers or pre-formed silica-based particles stabilized using diblock copolymers and may include chemical initiators to permit in situ polymerization within the via.
申请公布号 US2004185656(A1) 申请公布日期 2004.09.23
申请号 US20030393712 申请日期 2003.03.21
申请人 RAMACHANDRARAO VIJAYAKUMAR S.;TURKOT, ROBERT B. 发明人 RAMACHANDRARAO VIJAYAKUMAR S.;TURKOT, ROBERT B.
分类号 H01L21/768;(IPC1-7):H01L21/476 主分类号 H01L21/768
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