发明名称 METHOD FOR TRIMMING TWO WORKING LAYERS, AND TRIMMING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for trimming, at least by one trimming device, two working layers containing bonding abrasive grains and applied onto mutually facing sides of an upper working plate and a lower working plate of a grinding device for simultaneously processing both surfaces of a flat workpiece, and to provide the trimming device. <P>SOLUTION: A trimming body 8 is disposed in a ring-shaped region with a specified width on a trimming plate 9, an external gear part 10 of the trimming plate 9 is height-adjustable relative to the trimming plate 9, rotating directions of all drive units of a grinding device are changed at least two times during trimming or dressing, and removal of materials from the upper and lower working layers can be varied independently of each other according to previously measured shape profiles of the two working layers. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012030353(A) 申请公布日期 2012.02.16
申请号 JP20110164114 申请日期 2011.07.27
申请人 SILTRONIC AG 发明人 PIETSCH GEORG;KERSTAN MICHAEL
分类号 B24B53/12;B24B37/00;B24B53/013;H01L21/304 主分类号 B24B53/12
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