发明名称 Silicone Carbide Trench Semiconductor Device
摘要 A semiconductor device as described herein includes a silicon carbide semiconductor body. A trench extends into the silicon carbide semiconductor body at a first surface. A gate dielectric and a gate electrode are formed within the trench. A body zone of a first conductivity type adjoins to a sidewall of the trench, the body zone being electrically coupled to a contact via a body contact zone including a higher maximum concentration of dopants than the body zone. An extension zone of the first conductivity type is electrically coupled to the contact via the body zone, wherein a maximum concentration of dopants of the extension zone along a vertical direction perpendicular to the first surface is higher than the maximum concentration of dopants of the body zone along the vertical direction. A distance between the first surface and a bottom side of the extension zone is larger than the distance between the first surface and the bottom side of the trench.
申请公布号 US2012037920(A1) 申请公布日期 2012.02.16
申请号 US20100854974 申请日期 2010.08.12
申请人 TREU MICHAEL;SIEMIENIEC RALF;INFINEON TECHNOLOGIES AUSTRIA AG 发明人 TREU MICHAEL;SIEMIENIEC RALF
分类号 H01L29/24 主分类号 H01L29/24
代理机构 代理人
主权项
地址