HEAT CONDUCTION MEASURING DEVICE AND HEAT CONDUCTION MEASURING METHOD

摘要

A thermal conduction measuring apparatus (10) comprising: an upper rod (23) thermally connected to a heating source; a lower rod (25) thermally connected to a cooling source; a cartridge (24) having a sample block (24a) thermally coupled with the upper rod (23) and a sample block (24b) thermally coupled with the lower rod (25), and sandwichingly holding a sample (W) between the sample blocks (24a, 24b); a temperature sensor (45, 46) adapted to measure respective temperatures of the sample blocks (24a, 24b); a temperature calculation section (66) operable to derive a temperature gradient in the upper rod (23) and a temperature gradient in the lower rod (25) and then derive a temperature difference between the sample blocks (24a, 24b) from the temperatures measured by the temperature sensor (45, 46); and a physical-property-value derivation section (67) operable to derive a thermal conduction-related physical property value of the sample (W) based on a calculation result by the temperature calculation section (66).