发明名称
摘要 <p>PROBLEM TO BE SOLVED: To improve the setting precision of reference height in the thrust mechanism of a die bonder. SOLUTION: A plate PL is kept above the thrust mechanism 2, and the collet C of a suction mechanism 1 is lowered. The collet C is brought into contact with the surface of the plate PL and a thrust needle N is gradually raised. The thrust needle N reaches the rear face of the plate PL and the plate PL is lifted. Thus, the position of the thrust needle N when the position of the collet C starts rising or when it rises by a prescribed distance is stored in the thrust mechanism 2 (die bonder) as reference height.</p>
申请公布号 JP4875263(B2) 申请公布日期 2012.02.15
申请号 JP20010279065 申请日期 2001.09.14
申请人 发明人
分类号 H01L21/52;H01L21/67 主分类号 H01L21/52
代理机构 代理人
主权项
地址