发明名称 FLEXIBLE WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To prevent dew condensation onto the surface of the electrode terminal of a flexible wiring board without affected by the dew condensation on the connector side of an electric apparatus. SOLUTION: The flexible wiring board comprises a reinforcing plate 8 in an insulating film 2 on the back of a flexible wiring board 4 to constitute an electric terminal 5. A foamed layer 9 (or an air layer 9a) which is hermetically sealed between the insulating film 2 and the reinforcing plate 8 is provided. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005051177(A) 申请公布日期 2005.02.24
申请号 JP20030284253 申请日期 2003.07.31
申请人 SONY CORP 发明人 KITAMURA SACHIKO
分类号 H05K1/11;H05K1/02;(IPC1-7):H05K1/11 主分类号 H05K1/11
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