发明名称 |
COMPOSITION FOR SEMICONDUCTOR DEVICE CLEANING |
摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning agent composition containing sulfur for cleaning a semiconductor device having aluminum interconnect lines and manufacturing methods for a semiconductor device having protective film containing sulfur element on the surface of aluminum interconnect lines and a semiconductor device having a production process to form the protective film. SOLUTION: The cleaning agent composition containing sulfur for cleaning the semiconductor device having aluminum interconnect lines is capable of forming a protective film containing sulfur atoms on the surface of the aluminum film in the test of protective film formation. The semiconductor device has the protective film containing sulfur atoms on the surface of aluminum interconnect lines and also contains sulfur atoms in the region at least within 5 nm in the direction of thickness from the surface of the protective film. The manufacturing method for the semiconductor device is also provided. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005210082(A) |
申请公布日期 |
2005.08.04 |
申请号 |
JP20040348980 |
申请日期 |
2004.12.01 |
申请人 |
KAO CORP |
发明人 |
TAMURA ATSUSHI;DOI YASUHIRO |
分类号 |
C11D7/08;C11D7/10;C11D7/26;C11D7/36;H01L21/304;H01L21/3205;H01L23/52;(IPC1-7):H01L21/304;H01L21/320 |
主分类号 |
C11D7/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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