发明名称 WAFER TRANSFER HANDLING METHOD, AND SEMICONDUCTOR MANUFACTURING APPARATUS USING THE SAME
摘要 PROBLEM TO BE SOLVED: To prevent erroneous transfer due to wafer displacement of a wafer processing container of a semiconductor manufacturing apparatus, and to prevent anomalies during wafer processing. SOLUTION: Before the rise of an auxiliary table for the vacuum adsorption of a carried-in wafer, the wafer stays in standby until the other table has been completely evacuated (S21). The auxiliary table is lowered with the wafer adsorbed thereto for placing it on the other table, and the wafer 1 remains adsorbed for one second after the descent (S22). The slow evacuation of the wafer processing container through a gas outlet 8 is started with the wafer kept vacuum-adsorbed for avoiding the adverse effect of fluctuation in pressure in the wafer processing container, and the wafer is released from adsorption thereafter (S23). Furthermore, when the wafer is vacuum-adsorbed simultaneously accompanied by the rise of the auxiliary table after the descent of the other table upon the completion of the wafer processing, it is confirmed that the evacuation of the other table has been completed (S24). The use of these steps eliminates erroneous transfer due to wafer displacement in the wafer processing container or other anomalies during the wafer processing. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005209859(A) 申请公布日期 2005.08.04
申请号 JP20040014348 申请日期 2004.01.22
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MAEKAWA YASUO
分类号 H01L21/677;H01L21/68;H01L21/683;(IPC1-7):H01L21/68 主分类号 H01L21/677
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