| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic part bonding apparatus which can prevent the generation of poor bonding in a bonding process and which is excellent in the operability of bonding condition parameter setting, and to provide an electronic part bonding method. SOLUTION: In the electronic part bonding which bonds an electronic part to a substrate by a pushing load and swinging, bonding condition parameters, such as a pushing operation which forces the electronic part to the substrate, activation of a supersonic vibration, and suction/blow by an absorption tool are set on a bonding conditioning setting screen. A pushing means, a vibration giving means, and a suction release means are controlled by following a bonding condition set in the bonding process. When the vibration is given to the electronic part, a vacuum suction is switched to a blow, and the suction of the electronic part is canceled. COPYRIGHT: (C)2005,JPO&NCIPI |
