Secure electronic module, device with secure electronic module and manufacturing method

摘要

The module (1) has a rigid dielectric base film (3) provided with an electrical contact area (5) on one surface of the film and an electronic chip (9) on an opposite surface of the film. The electronic chip is connected to the electrical contact area via an electrical connector (11) traversing an opening of the film. The film includes expanded surfaces (7) extending outside a plane of the film to increase an adhesive surface of the module. The expanded surfaces are located on a peripheral area of the module. The chip and the connector are encapsulated in a protective resin (13). An independent claim is also included for a method for manufacturing a secure electronic module.