| 摘要 |
Embodiments of the invention include an electrical circuit arrangement including a switchably removable bond pad extension test pad that allows improved testing of a corresponding electrical circuit device via enhanced placement of testing probes. The bond pad extension test pad is removably coupled to one of the electrical circuit device's electrical components, e.g., a bond pad. Because the bond pad extension test pad can be disconnected from the electrical component when not testing, the bond pad extension test pad does not contribute additional parasitic effects to the corresponding electrical circuit device. The electrical circuit arrangement automatically detects when a testing voltage is applied to the bond pad extension test pad, then connects the bond pad extension test pad in response to the detection of the applied testing voltage. When a testing voltage is not applied to bond pad extension test pad, the electrical circuit arrangement disconnects the test pad from the associated electrical component. |
