发明名称 |
Gas-cooled clamp for RTP |
摘要 |
The present invention is directed to a semiconductor thermal processing apparatus and a method for thermally cooling a semiconductor substrate. According to one aspect of the present invention, a gas-cooled clamp and associated method is disclosed which provides cooling of a substrate by thermal conduction generally in the free molecular regime. The gas-cooled clamp comprises a clamping plate having a plurality of protrusions that define gaps therebetween, wherein a distance or depth of the gaps are associated with a mean free path of the cooling gas therein. The gas-cooled clamp further comprises a pressure control system operable to control a backside pressure of the cooling gas within the plurality of gaps to thus control a heat transfer coefficient of the cooling gas, wherein the heat transfer coefficient of the cooling gas is primarily a function of the pressure and substantially independent of the gap distance.
|
申请公布号 |
US7033443(B2) |
申请公布日期 |
2006.04.25 |
申请号 |
US20030402809 |
申请日期 |
2003.03.28 |
申请人 |
AXCELIS TECHNOLOGIES, INC. |
发明人 |
KELLERMAN PETER L.;BENVENISTE VICTOR M.;CARLSON FREDERICK M. |
分类号 |
H01L21/00;C23C16/00;C23C16/458;H01L21/687 |
主分类号 |
H01L21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|