| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink free from breakage such as a crack due to heat and permitting a semiconductor element to be mounted on a correct position, and to provide its manufacturing method. SOLUTION: The heat sink has a mount chip on which a semiconductor element is embedded in a heat dissipator. The mount chip is embedded with its side face not joining with the heat dissipator. In addition, the upper surface of the chip and the upper surface of the heat dissipator are approximately leveled. The heat sink is preferably manufactured by fixing the mount chip to the heat dissipator, and thereafter pressing the chip by machining by a header to embed in the heat dissipator, so that the upper surfaces of the chip and the heat dissipator are leveled. COPYRIGHT: (C)2007,JPO&INPIT |
