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发明名称
Stack chip package having heat emission means
摘要
申请公布号
KR101111423(B1)
申请公布日期
2012.02.15
申请号
KR20090093660
申请日期
2009.10.01
申请人
发明人
分类号
H01L23/36;H01L23/12
主分类号
H01L23/36
代理机构
代理人
主权项
地址
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