| 摘要 |
<p>Disclosed is a positive resist composition containing a base resin component (A) having an acid-cleavable dissolution inhibiting group whose alkali solubility is increased by the action of an acid, and an acid generator component (B) which generates an acid when irradiated with radiation. The component (A) contains a resin having an absorbance of not more than 1.0 (1/mum) at 193 nm and a dispersity (Mw/Mn) of not more than 1.5. This positive resist composition is applicable to thermal flow processes.</p> |
