| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate material for mounting semiconductor element, which is lightweight, is excellent in thermal-expansion-coefficient matching between itself and peripheral materials, has high thermal conductivity, has uniform distribution of reinforcement particles, is easy to work into a thin shape or a complicated shape, and has a low manufacturing cost. SOLUTION: The substrate material member for mounting semiconductor element is manufactured by continuous casting and rolling. The substrate material is composed of an alloy containing one kind of metal selected from a group consisting of aluminum and magnesium as the main component, which contains particles of a material containing at least one kind selected from a group consisting of aluminum oxide, silicon nitride, silicon carbide, titanium boride, beryllium oxide, silicon oxide, molybdenum, niobium, and tungsten with a volume ratio of 5 volume% or more and 70 volume% or less, while the particles are uniformly dispersed. COPYRIGHT: (C)2007,JPO&INPIT |
