| 摘要 |
A semiconductor device according to the present invention including: a semiconductor substrate having a through hole formed towards one surface side from the other surface side; an electrode pad arranged on the one surface side of the semiconductor substrate and partially exposed to the through hole; and a through electrode arranged at an inner side of the through hole and electrically connected to the electrode pad, wherein a connection portion between the electrode pad and the through electrode is arranged in a region within a plane of the electrode pad which is close to the center of the semiconductor substrate rather than to a center of the electrode pad. |
