发明名称 |
FLEXIBLE LEITERPLATTE UND HERSTELLUNGSVERFAHREN DAFÜR |
摘要 |
<p>] A flexible printed circuit and fabrication method thereof is provided. At least one signal wire is disposed on a plastic substrate. Two ground lines are disposed at both sides of the signal wire in parallel. A shielding layer is provided, contacting the plastic substrate to form a chamber, wherein the signal wire and ground lines are wrapped therein. A flexible dielectric layer is implemented between the signal wire and the shielding layer to provide electricity isolation.</p> |
申请公布号 |
AT543372(T) |
申请公布日期 |
2012.02.15 |
申请号 |
AT20090171657T |
申请日期 |
2009.09.29 |
申请人 |
HTC CORPORATION |
发明人 |
WU, CHUNG-LUN;CHU, FU-AN;LI, JA-EE |
分类号 |
H05K1/02;H05K3/46 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|