| 摘要 |
AN EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTORS CONTAINING AN EPOXY RESIN, A PHENOL RESIN, AN INORGANIC FILLER, A CURING ACCELERATOR, A GLYCEROL TRI-FATTY ACID ESTER PRODUCED BY DEHYDRATION CONDENSATION REACTION OF GLYCEROL AND A SATURATED FATTY ACID WITH A CARBON ATOM CONTENT OF 24-36, AND A HYDROTALCITE COMPOUND AS ESSENTIAL COMPONENTS IS PROVIDED. THE RESIN COMPOSITION EXHIBITS EXCELLENT MOLD RELEASABILITY AND PRODUCES ONLY A SLIGHT AMOUNT OF STAINS ON THE SURFACES OF THE MOLD AND SEMICONDUCTOR PACKAGES. A SEMICONDUCTOR DEVICE EXHIBITING EXCELLENT SOLDER RESISTANCE IS ALSO PROVIDED. |
