| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface acoustic wave filter package having high heat radiation effects. SOLUTION: The filer package is provided with a first through hole 43 with a conductive member 35 and a second through hole 31 with a first heat-conducting member 37 on a wiring board 11. An airtight holding body 15 is mounted in an airtight holder mounting region on the wiring board 11, and connected to a rear surface of a surface acoustic wave filter 13a via the second heat-conducting member 19. The filer package further comprises grounding electrodes 51, 55 formed over the airtight holder mounting region of the wiring board 11 and a filter-mounting region, and connected to the first through hole 43 and the second through hole 31. Heat generated by the surface acoustic wave filter 13a can be effectively radiated to the wiring board 11 via the first heat-conducting member or the second heat-conducting member. COPYRIGHT: (C)2007,JPO&INPIT |
