| 发明名称 |
SUBMOUNT AND METHOD FOR MANUFACTURING SAME |
| 摘要 |
<p>A submount (50) comprising a submount substrate (52) and a solder layer (54) adherently deposited on the submount substrate (52) for soldering with a semiconductor device, characterized in that said solder layer (54) is formed of constituent elements in a composition ratio which varies in a depth direction of said solder layer (54).</p> |
| 申请公布号 |
EP1868241(A4) |
申请公布日期 |
2012.02.15 |
| 申请号 |
EP20060729450 |
申请日期 |
2006.03.17 |
| 申请人 |
DOWA ELECTRONICS MATERIALS CO., LTD. |
发明人 |
OSHIKA, YOSHIKAZU;NAKANO, MASAYUKI |
| 分类号 |
H01L23/12;B23K35/30;H01L21/52 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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