| 摘要 |
PROBLEM TO BE SOLVED: To lengthen the TC (Temperature Cycle)-resistant lifetime of connecting bumps of a mounting structure in which flip-chip connection of a semiconductor chip on a circuit board is carried out by using solder bumps. SOLUTION: In the mounting structure, the semiconductor chip 16 is flip-chip connected on the circuit board 12 by the connecting bumps 14. In the mounting structure; a reinforcing material 18 is fixed on the circuit board 12 in the periphery of the semiconductor chip 16, and the reinforcing material 18 and the side face of the semiconductor chip 16 are joined with a resin adhesive 20. The reinforcing material 18 has a Young's modulus of 50 GPa or more at room temperature, and has the coefficient of linear expansion the same as or smaller than the connecting bumps 14. The resin adhesive 20 has the Young's modulus of 5 GPa or more at room temperature. A space is set in 50 μm or less between the reinforcing material 18 joined with the resin adhesive 20 and the side face of the semiconductor chip 16. COPYRIGHT: (C)2007,JPO&INPIT |
