发明名称 SUBSTRATE FOR PASSIVE ELEMENTS, PASSIVE ELEMENT CHIPS, AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To materialize an inexpensive substrate for passive elements which can reduce the time duration and effort concerning cutting, and also consists of a glass substrate capable of performing cutting by using a laser beam with the wavelength of 1,000 nm-1,100 nm. SOLUTION: The substrate for passive elements is added with Fe and comprised of the glass substrate 1 with high absorptivity in the wavelength of 1,000 nm-1,100 nm. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008028334(A) 申请公布日期 2008.02.07
申请号 JP20060202329 申请日期 2006.07.25
申请人 SHARP CORP 发明人 YOSHIKAWA MITSUNORI
分类号 H01L23/15 主分类号 H01L23/15
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