发明名称 SUBSTRATE CLEANING LIQUID
摘要 PROBLEM TO BE SOLVED: To provide a substrate cleaning liquid capable of cleaning numerous substrates without corroding a copper wire by keeping effects of an anticorrosive in the substrate cleaning liquid for a long time. SOLUTION: The substrate cleaning liquid contains fluoride salt, an anticorrosive, a surfactant, and an aqueous solvent. The anticorrosive is a triazole compound. The surfactant is one or more selected from a group including polyether polyol, alkylbetaine, phosphoric acid ester compound, and polystyryl phenylether. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008027984(A) 申请公布日期 2008.02.07
申请号 JP20060195882 申请日期 2006.07.18
申请人 TOKUYAMA CORP;AZ ELECTRONIC MATERIALS KK 发明人 TONO SEIJI;OTANI TOSHIAKI;NAZUKA YASUTAKA;KOBAYASHI MASAICHI
分类号 H01L21/304;C11D1/34;C11D1/72;C11D1/90;C11D3/04;C11D3/28;C11D3/37;C11D3/43;C11D17/08;G02F1/13;H01L21/3205;H01L21/768 主分类号 H01L21/304
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