APPARATUS AND METHOD FOR ARRANGING DEVICES FOR PROCESSING

摘要

APPARATUS AND METHOD FOR ARRANGING 5 DEVICES FOR PROCESSING AN APPARATUS IS PROVIDED FOR ARRANGING FOR PROCESSING A SEMICONDUCTOR DEVICE HAVING SURFACE COMPONENTS ON ITS SURFACE. A DEVICE SUPPORT COMPRISING A SET OF PROTRUSIONS FOR CONTACTING A SURFACE OF THE SEMICONDUCTOR DEVICE SUPPORTS THE 10 SEMICONDUCTOR DEVICE ON A PLANE. THE PROTRUSIONS ARE ARRANGED AND POSITIONED SUCH THAT THEY AVOID CONTACT WITH THE SURFACE COMPONENTS ON THE SURFACE. IN ORDER TO GRIP THE SEMICONDUCTOR DEVICE SUPPORTED ON THE PLANE, A CLAMPING DEVICE HAVING A FIRST SET OF CLAMPS IS CONFIGURED FOR GRIPPING THE SEMICONDUCTOR DEVICE ALONG A FIRST AXIS AND A SECOND SET OF CLAMPS IS CONFIGURED FOR GRIPPING THE 15 SEMICONDUCTOR DEVICE ALONG A SECOND AXIS PERPENDICULAR TO THE FIRST AXIS. (FIG. 2A)