发明名称 Light emitting diode package
摘要 Provided is an LED package. It is easy to control luminance according to the luminance and an angle applicable. Since heat is efficiently emitted, the LED package is easily applicable to a high luminance LED. The manufacturing process is convenient and the cost is reduced. The LED package includes a substrate, an electrode, an LED, and a heatsink hole. The electrode is formed on the substrate. The LED is mounted in a side of the substrate and is electrically connected to the electrode. The heatsink hole is formed to pass through the substrate, for emitting out heat generated from the LED.
申请公布号 US8115225(B2) 申请公布日期 2012.02.14
申请号 US20100683929 申请日期 2010.01.07
申请人 KIM WAN HO;LG INNOTEK CO., LTD. 发明人 KIM WAN HO
分类号 H01L33/00;H01L33/48;H01L33/60;H01L33/64 主分类号 H01L33/00
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