发明名称 Localized over-molding die structure
摘要 A localized over-molding die structure may include a core die, a cavity die having an inner space therein and placed onto an upper surface of the core die, and a slide die including a step portion on a lower surface thereof and slidably engaged with the cavity die in the inner space thereof to move upward and downward, wherein, the step portion includes an undercut formed at a lateral side thereof such that when at least two materials are successively injected into the cavity die, a corresponding part to the undercut is formed to at least one of the at least two materials.
申请公布号 US8113809(B2) 申请公布日期 2012.02.14
申请号 US20100832775 申请日期 2010.07.08
申请人 KONG BYUNG SEOK;PARK JIN-WAN;HYUNDAI MOTOR COMPANY;KIA MOTORS CORPORATION;DUCKYANG IND. CO. LTD. 发明人 KONG BYUNG SEOK;PARK JIN-WAN
分类号 B29C45/44 主分类号 B29C45/44
代理机构 代理人
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