发明名称 |
Integrated circuit package system with thin profile |
摘要 |
An integrated circuit package system is provided including attaching an external interconnect on a tape; attaching a backside element on the tape adjacent to the external interconnect; attaching an integrated circuit die with the backside element, the backside element is on a first passive side of the integrated circuit die; connecting a first active side of the integrated circuit die and the external interconnect; and forming a first encapsulation over the integrated circuit die with the backside element exposed.
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申请公布号 |
US8115305(B2) |
申请公布日期 |
2012.02.14 |
申请号 |
US20070750218 |
申请日期 |
2007.05.17 |
申请人 |
CAMACHO ZIGMUND RAMIREZ;BATHAN HENRY DESCALZO;ADVINCULA ABELARDO HADAP;TAY LIONEL CHIEN HUI;STATS CHIPPAC LTD. |
发明人 |
CAMACHO ZIGMUND RAMIREZ;BATHAN HENRY DESCALZO;ADVINCULA ABELARDO HADAP;TAY LIONEL CHIEN HUI |
分类号 |
H01L23/48;H01L21/44 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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