发明名称 |
Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof |
摘要 |
A design structure is embodied in a machine readable medium for designing, manufacturing, or testing a design. The design structure includes a dielectric material formed between a design sensitive structure and a passivation layer. The design sensitive structure comprising a lower wiring layer electrically and mechanically connected to a higher wiring level by a via farm. A method and structure is also provided.
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申请公布号 |
US8114767(B2) |
申请公布日期 |
2012.02.14 |
申请号 |
US20080046616 |
申请日期 |
2008.03.12 |
申请人 |
DAUBENSPECK TIMOTHY H.;GAMBINO JEFFREY P.;MUZZY CHRISTOPHER D.;SAUTER WOLFGANG;ZIMMERMAN JEFFREY S.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DAUBENSPECK TIMOTHY H.;GAMBINO JEFFREY P.;MUZZY CHRISTOPHER D.;SAUTER WOLFGANG;ZIMMERMAN JEFFREY S. |
分类号 |
H01L21/4763 |
主分类号 |
H01L21/4763 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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