| 发明名称 |
Method for manufacturing light emitting diode chip and light emitting diode light source module |
| 摘要 |
The present invention relates to a method for manufacturing a light emitting diode (LED) chip for a chip on board and a method for manufacturing an LED light source module in a chip on board fashion. The method of the present invention includes forming a plurality of LED chips on a wafer, molding a region of each LED chip, cutting the wafer into each LED chip, and testing each LED chip for operating characteristics. |
| 申请公布号 |
US8114689(B2) |
申请公布日期 |
2012.02.14 |
| 申请号 |
US20070924927 |
申请日期 |
2007.10.26 |
| 申请人 |
KANG EUN JEONG;KIM GI CHERL;CHANG MOON HWAN;JEON EUN CHAE;LEE YOUNG KEUN;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KANG EUN JEONG;KIM GI CHERL;CHANG MOON HWAN;JEON EUN CHAE;LEE YOUNG KEUN |
| 分类号 |
H01L21/00;H01L33/00;H01L33/44 |
主分类号 |
H01L21/00 |
| 代理机构 |
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| 主权项 |
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| 地址 |
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