| 摘要 |
The present invention provides a composition of the modified maleic anhydride and the epoxy resins, including (A) one or more of the epoxy resin mixtures, (B) a modified maleic anhydride copolymer, (C) additives and (D) inorganic filler materials, wherein component (A) the epoxy resin mixture accounts for 35%˜56% by weight of the composition solids, component (B) the modified maleic anhydride copolymer accounts for 44%˜65% by weight of the composition solids, based on 100% by weight of total components (A), (B) and (C). According to the present invention, the modified maleic anhydride copolymer curing agent is prepared by reacting styrene/maleic anhydride copolymer with a modifier having hydroxy groups (OH), wherein the modifier having hydroxy groups (OH) can be a brominated, phosphorus-based or halogen-free material; the epoxy resin composition of the present invention shows good heat resistance and outstanding electrical properties, is suitable for the production of prepreg material, bonding films and copper clad laminates, thus can be used in the field of the general or high-frequency printed circuit boards. |
