发明名称 Method of fabricating high voltage device
摘要 A device for protecting a semiconductor device from electrostatic discharge may include a high voltage first conductivity type well formed in a semiconductor substrate. A first stack region may have a first conductivity type drift region, and a first conductivity type impurity region stacked in succession in the high voltage first conductivity type well. A second stack region may have a second conductivity type drift region, and a second conductivity type impurity region stacked in succession in the high voltage first conductivity type well. A device isolating film formed between the first stack region and the second stack region for isolating the first stack region from the second stack region.
申请公布号 US8114749(B2) 申请公布日期 2012.02.14
申请号 US20090630930 申请日期 2009.12.04
申请人 JANG JOON-TAE;DONGBU HITEK CO., LTD. 发明人 JANG JOON-TAE
分类号 H01L21/8222 主分类号 H01L21/8222
代理机构 代理人
主权项
地址