发明名称 Method of fabricating an ultra-small condenser microphone
摘要 In the present invention, a semiconductor substrate wherein a plurality of MEMS microphones is formed is disposed opposed to a discharge electrode in a state of being stuck on a sheet. Electretization of a dielectric film provided in the MEMS microphone is performed by irradiating the dielectric film between a fixed electrode and a vibration film provided in the MEMS microphone with ions resulting from a corona discharge of the discharge electrode in a state that a predetermined potential difference is applied to the fixed electrode and the vibration film and fixing charges based on the ions to the dielectric film. The electretization is successively performed to each MEMS microphone on the semiconductor substrate by relatively moving the semiconductor substrate and the discharge electrode. Therefore, electretization of the dielectric film in the MEMS microphone chip is realized using a low-cost and simple fabricating equipment and productivity can be enhanced.
申请公布号 US8114700(B2) 申请公布日期 2012.02.14
申请号 US20100917916 申请日期 2010.11.02
申请人 MIYASHITA YOSHIYUKI;DOI KAZUMOTO;IMAI TADAO;IWASEKI HIROAKI;PANASONIC CORPORATION 发明人 MIYASHITA YOSHIYUKI;DOI KAZUMOTO;IMAI TADAO;IWASEKI HIROAKI
分类号 H01L21/00;H04R31/00 主分类号 H01L21/00
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