| 发明名称 |
Method to form an interconnect |
| 摘要 |
A plurality of electrodes are electrically coupled to each other by conductive interconnects formed from selectively sintered nanoparticles.
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| 申请公布号 |
US8115313(B2) |
申请公布日期 |
2012.02.14 |
| 申请号 |
US20060581047 |
申请日期 |
2006.10.12 |
| 申请人 |
WENG JIAN-GANG;PRASAD RAVI;ADDINGTON CARY G.;NYHOLM PETER S.;HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
WENG JIAN-GANG;PRASAD RAVI;ADDINGTON CARY G.;NYHOLM PETER S. |
| 分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
| 代理机构 |
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