| 摘要 |
PURPOSE: A substrate heating apparatus with a cooling device is provided to remarkably improve cooling efficiency by changing a line contact structure of a cooling line and a heating line into a surface contact structure. CONSTITUTION: An insertion hole having a constant depth is formed to generate a specific pattern in a bottom surface of a main body(10). A heating line(20) is arranged in the insertion hole. A cooling unit is arranged in the heating line to be surface-contacted and includes a circulation flow path in which a refrigerant circulates. A cover is combined with an inlet part of the insertion hole. An adhesion groove is formed in an upper side of the cooling unit to be closely attached to a bottom surface of the heating line. A hollow cooling line, in which the circulation flow path is formed, is formed in the cooling unit.
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