Fabricating method of semiconductor device

摘要

PURPOSE: A method for manufacturing a semiconductor device is provided to improve the reliability of a semiconductor die by forming a stud bump on the semiconductor die. CONSTITUTION: A plurality of stud bumps are formed on the upper side of a semiconductor die. A first sealing unit seals the semiconductor die and exposes a part of the stud bump. A rewiring layer(130) is formed on the first sealing unit and is electrically connected to the stud bump. A solder ball(140) is electrically connected to the rewiring layer. A second sealing unit(152) seals the rewiring layer and the first sealing unit and exposes a part of the solder ball.