| 摘要 |
PROBLEM TO BE SOLVED: To obtain an adhesive composition for a semiconductor, which does not causes cracking and peeling by bending and is laminated to the electrode side of a semiconductor wafer with a bump electrode having a narrow pitch and a high pin number, is cut at a high speed without contamination and deficiency of cut powder during dicing and has a high relative dielectric constant. SOLUTION: The adhesive composition for a semiconductor comprises (a) an organic solvent-soluble polyimide, (b) an epoxy compound, (c) a curing promoter and (d) a high-dielectric constant inorganic particle having a perovskite-type crystal structure or a complex perovskite-type crystal structure in the ratio of 15-90 pts.wt. of (a) the organic solvent-polyimide and 0.1-10 pts.wt. of (c) the curing promoter based on 100 pts.wt. of (b) the epoxy compound. (b) The epoxy compound comprises a compound that is liquid at 25°C under 1.013×10<SP>5</SP>N/m<SP>2</SP>and a compound that is solid at 25°C under 1.013×10<SP>5</SP>N/m<SP>2</SP>and the content of the liquid epoxy compound is≥20 wt.% and≤60 wt.% based on the total epoxy compound. COPYRIGHT: (C)2008,JPO&INPIT |
