| 摘要 |
PROBLEM TO BE SOLVED: To achieve stabilization in the quality of a substrate having a fine uneven pattern on its surface and further achieving the thickness reduction and miniaturization of the substrate. SOLUTION: A tabular article to be processed having a smooth resin surface provided on at least one side thereof is used. During a die operation process wherein a die for punching the article to be processed into a predetermined shape is moved from an initial position to be returned to the initial position through a punching position, at least one of a transfer member having an uneven pattern formed on its surface and the article to be processed is raised in temperature by heating and, in this state, the uneven pattern of the transfer member is pressed to the resin surface of the article to be processed to perform a transfer process for transferring the uneven pattern to a place positioned with respect to a predetermined punching shape. COPYRIGHT: (C)2008,JPO&INPIT |
