| 发明名称 |
Slurry for CMP and CMP method |
| 摘要 |
A CMP slurry comprising polishing abrasives containing mixture abrasives of silica and alumina is used. In CMP using the slurry comprising mixture abrasives of silica and alumina as polishing abrasives, a down force-dependency of a polishing rate is high and an increase in dishing can be effectively suppressed. |
| 申请公布号 |
US7364667(B2) |
申请公布日期 |
2008.04.29 |
| 申请号 |
US20020155015 |
申请日期 |
2002.05.28 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
MINAMIHABA GAKU;YANO HIROYUKI |
| 分类号 |
B24B37/00;C09K13/00;C09G1/02;C09K3/14;C23F3/00;H01L21/304;H01L21/321 |
主分类号 |
B24B37/00 |
| 代理机构 |
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